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SN74CB3Q3125PW Folha de dados(PDF) 4 Page - Texas Instruments

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Nome de Peças SN74CB3Q3125PW
Descrição Electrónicos  Quadruple FET Bus Switch
Download  26 Pages
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Fabricante Electrônico  TI1 [Texas Instruments]
Página de início  http://www.ti.com
Logo TI1 - Texas Instruments

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SN74CB3Q3125
SCDS143C – OCTOBER 2003 – REVISED JUNE 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
VCC
Supply voltage
–0.5
4.6
V
VIN
Control input voltage(2)(3)
–0.5
7
V
VI/O
Switch I/O voltage(2)(3)(4)
–0.5
7
V
II/K
Control input clamp current
VIN < 0
–50
mA
II/OK
I/O port clamp current
VI/O < 0
–50
mA
IIO
ON-state switch current(5)
±64
mA
Continuous current through VCC or GND
±100
mA
TJ
Junction temperature
150
°C
Tstg
Storage temperature
–65
150
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltages are with respect to ground, unless otherwise specified.
(3)
The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
(4)
VI and VO are used to denote specific conditions for VI/O.
(5)
II and IO are used to denote specific conditions for II/O.
6.2 ESD Ratings
VALUE
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
+2000
V(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per JEDEC specification JESD22-
+1000
C101(2)
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
VCC
Supply voltage
2.3
3.6
V
VCC = 2.3 V to 2.7 V
1.7
5.5
VIH
High-level control input voltage
V
VCC = 2.7 V to 3.6 V
2
5.5
VCC = 2.3 V to 2.7 V
0
0.7
VIL
Low-level control input voltage
V
VCC = 2.7 V to 3.6 V
0
0.8
VI/O
Data input and output voltage
0
5.5
V
TA
Operating free-air temperature
–40
85
°C
(1)
All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs (SCBA004).
6.4 Thermal Information
SN74CB3Q3257
DBQ
THERMAL METRIC(1)
DGV (TVSOP)
PW (TSSOP)
RGY (VQFN)
UNIT
(SSOP)
16 PINS
14 PINS
14 PINS
14 PINS
RθJA
Junction-to-ambient thermal resistance
90
127
113
47
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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