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DAC5311IDCKTG4 Folha de dados(PDF) 4 Page - Texas Instruments

Nome de Peças DAC5311IDCKTG4
Descrição Electrónicos  12-Bit, Low-Power, Single-Channel Digital-to-Analog Converters in SC70 Package
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Fabricante Electrônico  TI1 [Texas Instruments]
Página de início  http://www.ti.com
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DAC5311IDCKTG4 Folha de dados(HTML) 4 Page - Texas Instruments

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DAC5311, DAC6311, DAC7311
SBAS442C – AUGUST 2008 – REVISED JULY 2015
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
AVDD to GND
–0.3
+6
V
Voltage
Digital input voltage to GND
–0.3
+AVDD + 0.3
V
VOUT to GND
–0.3
+AVDD + 0.3
V
Junction, TJ max
150
°C
Temperature
Storage, Tstg
–65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
VALUE
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±1000
Electrostatic
V(ESD)
V
discharge
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
±500
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
TA
Operating temperature
–40
125
°C
AVDD
Supply voltage
2
5.5
V
7.4 Thermal Information
DACx311
THERMAL METRIC(1)
DCK (SC70)
UNIT
6 PINS
RθJA
Junction-to-ambient thermal resistance
216.4
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
52.1
°C/W
RθJB
Junction-to-board thermal resistance
65.9
°C/W
ψJT
Junction-to-top characterization parameter
1.3
°C/W
ψJB
Junction-to-board characterization parameter
65.2
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
N/A
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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Copyright © 2008–2015, Texas Instruments Incorporated
Product Folder Links: DAC5311 DAC6311 DAC7311


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