ADM1278-1BCPZ datasheet(10/61 Pages) AD

Nome de Peças	ADM1278-1BCPZ

Descrição Electrónicos	Hot Swap Controller and Digital Power and Energy Monitor with PMBus Interface

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Fabricante Electrônico	AD [Analog Devices]

Página de início	http://www.analog.com

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ADM1278

Data Sheet

ABSOLUTE MAXIMUM RATINGS

Table 6.

Parameter

Rating

VCC Pin

−0.3 V to +25 V

UV Pin

−0.3 V to +4 V

OV Pin

−0.3 V to +4 V

ISTART Pin

−0.3 V to +4 V

TIMER Pin

−0.3 V to VCAP + 0.3 V

TEMP Pin

−0.3 V to VCAP + 0.3 V

VCAP Pin

−0.3 V to +4 V

ISET Pin

−0.3 V to +4 V

PSET Pin

−0.3 V to +4 V

FAULT Pin

−0.3 V to +25 V

RETRY Pin

−0.3 V to +4 V

PWGIN Pin

−0.3 V to +4 V

SCL Pin

−0.3 V to +6.5 V

SDA Pin

−0.3 V to +6.5 V

SPI_SS Pin

−0.3 V to +4 V

MCLK Pin

−0.3 V to +4 V

MDAT Pin

−0.3 V to +4 V

ADR1 Pin

−0.3 V to +6.5 V

ADR2 Pin

−0.3 V to +6.5 V

ENABLE Pin

−0.3 V to +25 V

GPO1/ALERT1/CONV Pin

−0.3 V to +25 V

GPO2/ALERT2 Pin

−0.3 V to +25 V

PWRGD Pin

−0.3 V to +25 V

VOUT Pin

−0.3 V to +25 V

GATE Pin (Internal Supply Only)1

−0.3 V to +36 V

HS+ Pin

−0.3 V to +25 V

HS− Pin

−0.3 V to +25 V

MO+ Pin

−0.3 V to +25 V

MO− Pin

−0.3 V to +25 V

PGND

±0.3 V

VSENSE_HS (VHS+ − VHS−)

±0.3 V

VSENSE_MO (VMO+ − VMO−)

±0.3 V

CSOUT Short-Circuit Duration

Indefinite

Continuous Current into Any Pin

±10 mA

Storage Temperature Range

−65°C to +125°C

Operating Temperature Range

−40°C to +85°C

Lead Temperature, Soldering (10 sec)

300°C

Junction Temperature

105°C

1

The GATE pin has internal clamping circuits to prevent the GATE pin voltage

from exceeding the maximum ratings of a MOSFET with gain to source

voltage, VGSMAX = 20 V, and internal process limits. Applying a voltage source

to this pin externally may cause irreversible damage.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL CHARACTERISTICS

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 7. Thermal Resistance

Package Type

θJA

Unit

32-Lead LFCSP (CP-32-13)

32.5

°C/W

ESD CAUTION

Rev. A | Page 10 of 61

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