EnerChip™ Bare Die Batteries

©2016 Cymbet Corporation • Tel: +1-763-633-1780 • www.cymbet.com

DS-72-41 Rev06

Page 8 of 13

Preliminary

Figure 2: EnerChip Solder Reflow Profile

Parameter

Sn/Pb

Pb-free

Soak temperature, min, TSMIN

100°C

150°C

Soak temperature, max, TSMAX

150°C

200°C

Soak time, max, tS

2 min

2 min

Max ramp-up rate (TL to TP)

3°C/sec

3°C/sec

Liquidous temperature, TL

183°C

217°C

Time tL maintained above TL

60-150 sec

60-150 sec

Max peak temperature, TP

220°C

240°C

Max time tP at peak temperature TP

20 sec

30 sec

Max ramp-down rate (TP to TL)

6°C/sec

6°C/sec

Time 25°C to peak temperature

6 min max

8 min max

Figure 3: Solder Reflow Parameters as per IPC/JEDEC J-STD-020D.1

REFLOW SOLDERING

• The maximum number of times the battery may be reflow soldered is three times.

• The surface temperature of the battery must not exceed 240°C.

• The recommended solder reflow profile is shown in Figure 2 below; refer to Figure 3 Parameters table

for time and temperature requirements. Whenever possible, use lower temperature solder reflow

profiles.

• Never hand solder or reflow solder an EnerChip battery that has been charged as damage will occur.

TP

TL