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KMPC875CZT133 Folha de dados(PDF) 9 Page - Freescale Semiconductor, Inc |
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KMPC875CZT133 Folha de dados(HTML) 9 Page - Freescale Semiconductor, Inc |
9 / 84 page MPC875/MPC870 Hardware Specifications, Rev. 3.0 Freescale Semiconductor PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE 9 Thermal Characteristics 4 Thermal Characteristics Table 4 shows the thermal characteristics for the MPC875/870. 5 Power Dissipation Table 5 provides information on power dissipation. The modes are 1:1, where CPU and bus speeds are equal, and 2:1, where CPU frequency is twice bus speed. Table 4. MPC875/870 Thermal Resistance Data Rating Environment Symbol Value Unit Junction-to-ambient 1 1 Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal resistance. Natural convection Single-layer board (1s) RθJA 2 2 Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal. 43 °C/W Four-layer board (2s2p) RθJMA 3 3 Per JEDEC JESD51-6 with the board horizontal. 29 Airflow (200 ft/min) Single-layer board (1s) RθJMA 3 36 Four-layer board (2s2p) RθJMA 3 26 Junction-to-board 4 4 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface of the board near the package. RθJB 20 Junction-to-case 5 5 Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature. For exposed pad packages where the pad would be expected to be soldered, junction-to-case thermal resistance is a simulated value from the junction to the exposed pad without contact resistance. RθJC 10 Junction-to-package top 6 6 Thermal characterization parameter indicating the temperature difference between the package top and the junction temperature per JEDEC JESD51-2. Natural convection ΨJT 2 Airflow (200 ft/min) ΨJT 2 Table 5. Power Dissipation (PD) Die Revision Bus Mode Frequency Typical 1 1 Typical power dissipation is measured at V DDL = VDDSYN = 1.8 V, and VDDH is at 3.3 V. Maximum 2 Unit 0 1:1 66 MHz 310 390 mW 80 MHz 350 430 mW 2:1 133 MHz 430 495 mW |
Nº de peça semelhante - KMPC875CZT133 |
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Descrição semelhante - KMPC875CZT133 |
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