AM26C32

SLLS104K – DECEMBER 1990 – REVISED JUNE 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

7

V

A or B inputs

–11

14

Input voltage

V

G or G inputs

–0.5

Differential input voltage

–14

14

V

Output voltage

–0.5

V

Output current

±25

mA

Storage temperature

-65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values, except differential voltages, are with respect to the network ground terminal.

6.2 ESD Ratings

VALUE

UNIT

±3000

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-

±2000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage

4.5

5

5.5

V

High-level input voltage

2

V

Low-level input voltage

0

0.8

V

Common-mode input voltage

-7

+7

V

High-level output current

–6

mA

Low-level output current

6

mA

AM26C32C

0

70

AM26C32I

–40

85

Operating free-air temperature

°C

AM26C32Q

–40

125

AM26C32M

–55

125

6.4 Thermal Information

AM26C32

D (SOIC)

N (PDIP)

NS (SO)

PW (TSSOP)

UNIT

16 PINS

16 PINS

16 PINS

16 PINS

Junction-to-ambient thermal resistance

73

67

64

108

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

4

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