GATE

Source

DRAIN

M0161-01

GATE

Source

DRAIN

M0161-02

CSD16340Q3

SLPS247E – DECEMBER 2009 – REVISED AUGUST 2014

www.ti.com

5.2 Thermal Information

CSD16340Q3

UNITS

Q3 (8 PINS)

Junction-to-Ambient Thermal Resistance

42.0

Junction-to-Case (top) Thermal Resistance

20.6

Junction-to-Board Thermal Resistance

8.8

°C/W

Junction-to-Top Characterization Parameter

0.3

Junction-to-Board Characterization Parameter

8.7

Junction-to-Case (bottom) Thermal Resistance

0.1

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

For thermal estimates of this device based on PCB copper area, see the TI PCB Thermal Calculator.

when mounted on

when mounted on

minimum pad area of

2 oz. Cu.

4

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