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FDC2214 Folha de dados(PDF) 5 Page - Texas Instruments |
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FDC2214 Folha de dados(HTML) 5 Page - Texas Instruments |
5 / 61 page FDC2212, FDC2214, FDC2112, FDC2114 www.ti.com SNOSCZ5A – JUNE 2015 – REVISED JUNE 2015 Pin Functions (continued) PIN TYPE(1) DESCRIPTION NAME NO. IN3A 15 A Capacitive sensor input 3 (FDC2114 / FDC2214 only) IN3B 16 A Capacitive sensor input 3 (FDC2114 / FDC2214 only) DAP(2) DAP N/A Connect to Ground (2) There is an internal electrical connection between the exposed Die Attach Pad (DAP) and the GND pin of the device. Although the DAP can be left floating, for best performance the DAP should be connected to the same potential as the device's GND pin. Do not use the DAP as the primary ground for the device. The device GND pin must always be connected to ground. 8 Specifications 8.1 Absolute Maximum Ratings MIN MAX UNIT VDD Supply voltage range 5 V Vi Voltage on any pin –0.3 VDD + 0.3 V IA Input current on any INx pin –8 8 mA ID Input current on any digital pin –5 5 mA TJ Junction temperature –55 150 °C Tstg Storage temperature –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 8.2 ESD Ratings VALUE UNIT FDC2112 / FDC2212 in 12-pin WSON package Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22- ±750 C101(2) FDC2114 / FDC2214 in 16-pin WQFN package Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) ±2000 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22- ±750 C101(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 8.3 Recommended Operating Conditions Unless otherwise specified, all limits ensured for TA = 25°C, VDD = 3.3 V MIN NOM MAX UNIT VDD Supply voltage 2.7 3.6 V TA Operating temperature –40 125 °C 8.4 Thermal Information FDC2112 / FDC2214 / FDC2212 FDC2214 THERMAL METRIC(1) UNIT DNT (WSON) RGH (WQFN) 12 PINS 16 PINS RθJA Junction-to-ambient thermal resistance 50 38 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. Copyright © 2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: FDC2212 FDC2214 FDC2112 FDC2114 |
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