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LM2678 Folha de dados(PDF) 5 Page - Texas Instruments

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Nome de Peças LM2678
Descrição Electrónicos  LM2678 SIMPLE SWITCHER짰 High Efficiency 5-A Step-Down Voltage Regulator
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Fabricante Electrônico  TI1 [Texas Instruments]
Página de início  http://www.ti.com
Logo TI1 - Texas Instruments

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LM2678
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SNVS029J – MARCH 2000 – REVISED JULY 2016
Product Folder Links: LM2678
Submit Documentation Feedback
Copyright © 2000–2016, Texas Instruments Incorporated
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
(2)
Junction to ambient thermal resistance (no external heat sink) for the 7-lead TO-220 package mounted vertically, with ½ inch leads in a
socket, or on a PCB with minimum copper area.
(3)
Junction to ambient thermal resistance (no external heat sink) for the 7-lead TO-220 package mounted vertically, with ½ inch leads
soldered to a PCB containing approximately 4 square inches of (1 oz.) copper area surrounding the leads.
(4)
Junction to ambient thermal resistance for the 7-lead DDPAK mounted horizontally against a PCB area of 0.136 square inches (the
same size as the DDPAK package) of 1 oz. (0.0014 in. thick) copper.
(5)
Junction to ambient thermal resistance for the 7-lead DDPAK mounted horizontally against a PCB area of 0.4896 square inches (3.6
times the area of the DDPAK package) of 1 oz. (0.0014 in. thick) copper.
(6)
Junction to ambient thermal resistance for the 7-lead DDPAK mounted horizontally against a PCB copper area of 1.0064 square inches
(7.4 times the area of the DDPAK 3 package) of 1 oz. (0.0014 in. thick) copper. Additional copper area reduces thermal resistance
further.
(7)
Junction to ambient thermal resistance for the 14-lead VSON mounted on a PCB copper area equal to the die attach paddle.
(8)
Junction to ambient thermal resistance for the 14-lead VSON mounted on a PCB copper area using 12 vias to a second layer of copper
equal to die attach paddle. Additional copper area will reduce thermal resistance further. For layout recommendations, see AN-1187
Leadless Leadfram Package (LLP).
6.4 Thermal Information
THERMAL METRIC(1)
LM2678
UNIT
NDZ (TO-220)
KTW (TO-263)
NHM (VSON)
7 PINS
7 PINS
14 PINS
RθJA
Junction-to-ambient thermal resistance
See (2)
65
°C/W
See (3)
45
See (4)
56
See (5)
35
See (6)
26
See (7)
55
See (8)
29
RθJC(top) Junction-to-case (top) thermal resistance
2
2
°C/W
(1)
All room temperature limits are 100% tested during production with TA = TJ = 25°C. All limits at temperature extremes are specified
through correlation using standard Quality Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level
(AOQL).
(2)
Typical values are determined with TA = TJ = 25°C and represent the most likely norm.
6.5 Electrical Characteristics – 3.3 V
Specifications apply for TA = TJ = 25°C and RADJ = 5.6 kΩ (unless otherwise noted).
PARAMETER
TEST CONDITIONS
MIN(1)
TYP(2)
MAX(1) UNIT
VOUT
Output voltage
VIN = 8 V to 40 V,
100 mA
≤ IOUT ≤ 5 A
TJ = 25°C
3.234
3.3
3.366
V
TJ = –40°C to 125°C
3.201
3.399
η
Efficiency
VIN = 12 V, ILOAD = 5 A
82%
(1)
All room temperature limits are 100% tested during production with TA = TJ = 25°C. All limits at temperature extremes are specified
through correlation using standard Quality Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level
(AOQL).
(2)
Typical values are determined with TA = TJ = 25°C and represent the most likely norm.
6.6 Electrical Characteristics – 5 V
Specifications apply for TA = TJ = 25°C and RADJ = 5.6 kΩ (unless otherwise noted).
PARAMETER
TEST CONDITIONS
MIN(1)
TYP(2)
MAX(1) UNIT
VOUT
Output voltage
VIN = 8 V to 40 V,
100 mA
≤ IOUT ≤ 5 A
TJ = 25°C
4.9
5
5.1
V
TJ = –40°C to 125°C
4.85
5.15
η
Efficiency
VIN = 12 V, ILOAD = 5 A
84%


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