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TDA2HGBRQABCQ1 Folha de dados(PDF) 5 Page - Texas Instruments

Nome de Peças TDA2HGBRQABCQ1
Descrição Electrónicos  ADAS Applications Processor 23mm Package (ABC Package) Silicon Revision 2.0
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Fabricante Electrônico  TI1 [Texas Instruments]
Página de início  http://www.ti.com
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TDA2HGBRQABCQ1 Folha de dados(HTML) 5 Page - Texas Instruments

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TDA2SX, TDA2SG
TDA2HG, TDA2HV, TDA2LF
www.ti.com
SPRS951A – DECEMBER 2015 – REVISED APRIL 2016
Submit Documentation Feedback
Product Folder Links: TDA2SX TDA2SG TDA2HG TDA2HV TDA2LF
Revision History
Copyright © 2015–2016, Texas Instruments Incorporated
2
Revision History
Changes from December 18, 2015 to April 14, 2016 (from * Revision (December 2015) to A Revision)
Page
Device security features are added in Device Overview section
............................................................... 1
Added ”Related Products” section
.................................................................................................. 8
Added footnotes to the vout3_* signals which are muxed on vddshv6 power balls in Table 4-2 Ball Characteristics
. 12
Added footnotes to the vout3_* signals which are muxed on vddshv6 power balls in Table 4-5 DSS Signal
Descriptions
........................................................................................................................ 100
Signal Descriptions updated to remove redundancy
.......................................................................... 103
Text in ESD Ratings table clarified
.............................................................................................. 137
Note (5) in Table 5-7 is updated
................................................................................................. 143
“Added “Power Consumption Summary” section
.............................................................................. 158
Notes 9, 12 and 13 in Figure 5-1 are updated
................................................................................. 169
Notes 9, 12 and 13 in Figure 5-4 are updated
................................................................................. 175
Fixed some of the descriptions on GPMC and QSPI Manual Modes names in Table 7-2 “Modes Summary”
....... 193
Added new Manual Modes for: VOUT1, VOUT2 IOSET1, VOUT2 IOSET2 and VOUT3. Removed
DSS_VIRTUAL1
................................................................................................................... 193
New Timing information available for: Video Input Ports (VIP), Display Subsystem – Video Output Ports,
Multichannel Serial Peripheral Interface (MCSPI), Quad Serial Peripheral Interface (QSPI) and eMMC/SD/SDIO.
193
Corrected references for McASP Virtual modes in Table 7-2 “Modes Summary”
........................................ 193
Removed all vin4b_* signals from Table 7-9 Manual Functions Mapping for VIP2
....................................... 204
A caution and two notes are added in “Display Subsystem – Video Output Ports“ section stating that VOUT
signals are recommended to use the default SLEWCONTROL settings. Slow SLEWCONTROL should be used
instead
............................................................................................................................... 214
Flipped the "Parameter" entries for D5 and D6 in Table 7-16
............................................................... 214
Added footnotes to the vout3_* signals which muxed on vddshv6 power balls in Table 7-18 VOUT3 IOSETs.
..... 217
A new caution is added in “Quad Serial Peripheral Interface” subsection
................................................. 258
QSPI time value Q7 direction on Figure 7-30 through Figure 7-33 is updated to start prior CS
....................... 260
Added Table 7-49 through Table 7-56 to clarify the MCASP Virtual Timing Mode usage
............................... 270
An update is performed in the “Peripheral Component Interconnect Express (PCIe)” section.
......................... 286
Updated information for TPS65917 as supported PMIC
..................................................................... 349
Aligning "Device and Documentation Support" section with new flow
...................................................... 416
Updated Table 9-1 to help clarify the device nomenclature symbolization and orderable information.
................ 417
Аdded SR 2.0 in Table 9-1
....................................................................................................... 417
Added ”Related Links” section
................................................................................................... 420
Updated section “Mechanical Packaging and Orderable Information”
...................................................... 422


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