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LM2937IMPX-10 Folha de dados(PDF) 4 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
Nome de Peças LM2937IMPX-10
Descrição Electrónicos  500 mA Low Dropout Regulator
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Fabricante Electrônico  NSC [National Semiconductor (TI)]
Página de início  http://www.national.com
Logo NSC - National Semiconductor (TI)

LM2937IMPX-10 Folha de dados(HTML) 4 Page - National Semiconductor (TI)

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Electrical Characteristics
V
IN =VNOM + 5V, (Note 4) IOUTmax = 500 mA for the TO-220 and TO-263 packages, IOUTmax=400mA for the SOT-223 pack-
age, C
OUT = 10 µF unless otherwise indicated. Boldface limits apply over the entire operating temperature range of the
indicted device., all other specifications are for T
A =TJ = 25˚C.
Output Voltage (V
OUT)
12V
15V
Units
Parameter
Conditions
Typ
Limit
Typ
Limit
Output Voltage
5 mA
≤ I
OUT ≤ IOUTmax
11.64
14.55
V (Min)
12.00
11.40
15.00
14.25
V(Min)
12.36
15.45
V(Max)
12.60
15.75
V(Max)
Line Regulation
(V
OUT + 2V) ≤ VIN ≤ 26V,
36
120
45
150
mV(Max)
I
OUT =5 mA
Load Regulation
5 mA
≤ I
OUT ≤ IOUTmax
12
120
15
150
mV(Max)
Quiescent Current
(V
OUT + 2V) ≤ VIN ≤ 26V,
2
10
2
10
mA(Max)
I
OUT =5 mA
V
IN =(VOUT + 5V),
10
20
10
20
mA(Max)
I
OUT =IOUTmax
Output Noise
10 Hz–100 kHz,
360
450
µVrms
Voltage
I
OUT =5 mA
Long Term Stability
1000 Hrs.
44
56
mV
Dropout Voltage
I
OUT =IOUTmax
0.5
1.0
0.5
1.0
V(Max)
I
OUT = 50 mA
110
250
110
250
mV(Max)
Short-Circuit Current
1.0
0.6
1.0
0.6
A(Min)
Peak Line Transient
t
f < 100 ms, RL = 100Ω
75
60
75
60
V(Min)
Voltage
Maximum Operational
26
26
V(Min)
Input Voltage
Reverse DC
V
OUT ≥ −0.6V, RL = 100Ω
−30
−15
−30
−15
V(Min)
Input Voltage
Reverse Transient
t
r < 1 ms, RL = 100Ω
−75
−50
−75
−50
V(Min)
Input Voltage
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when operating the device
outside of its rated Operating Conditions.
Note 2: The maximum allowable power dissipation at any ambient temperature is PMAX = (125 − TA)/θJA, where 125 is the maximum junction temperature for op-
eration, TA is the ambient temperature, and θJA is the junction-to-ambient thermal resistance. If this dissipation is exceeded, the die temperature will rise above 125˚C
and the electrical specifications do not apply. If the die temperature rises above 150˚C, the LM2937 will go into thermal shutdown. For the LM2937, the
junction-to-ambient thermal resistance
θJA is 65˚C/W, for the TO-220 package, 73˚C/W for the TO-263 package, and 174˚C/W for the SOT-223 package. When used
with a heatsink,
θJA is the sum of the LM2937 junction-to-case thermal resistance θJC of 3˚C/W and the heatsink case-to-ambient thermal resistance. If the TO-263
or SOT-223 packages are used, the thermal resistance can be reduced by increasing the P.C. board copper area thermally connected to the package (see Application
Hints for more information on heatsinking).
Note 3: ESD rating is based on the human body model, 100 pF discharged through 1.5 k
Ω.
Note 4: Typicals are at TJ = 25˚C and represent the most likely parametric norm.
www.national.com
4


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