3

Regulatory Information

Thedevicescontainedinthisdatasheethavebeenapprovedbythefollowingorganizations:

Solder Reflow Thermal Profile

Recommended Pb-Free IR Profile

IEC/EN/DIN EN 60747-5-2

Approvedunder:

IEC60747-5-2:1997+A1:2002

EN60747-5-2:2001+A1:2002

DINEN60747-5-2(VDE0884Teil2):2003-01.

(Option060only)

UL

RecognizedunderUL1577,ComponentRecognition

Program,FileE55361.

CSA

ApprovedunderCSAComponentAcceptanceNotice

#5,FileCA88324.

217 °C

RAMP-DOWN

6 °C/SEC. MAX.

RAMP-UP

3 °C/SEC. MAX.

150 - 200 °C

260 +0/-5 °C

t 25 °C to PEAK

60 to 150 SEC.

20-40 SEC.

TIME WITHIN 5 °C of ACTUAL

PEAKTEMPERATURE

tp

ts

PREHEAT

60 to 180 SEC.

tL

TL

Tsmax

Tsmin

25

Tp

TIME

NOTES:

THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.

Tsmax = 200 °C, Tsmin = 150 °C

Note: Non-halide flux should be used.

0

TIME (SECONDS)

200

100

50

150

100

200

250

300

0

30

SEC.

50 SEC.

30

SEC.

160°C

140°C

150°C

PEAK

TEMP.

245°C

PEAK

TEMP.

240°C

PEAK

TEMP.

230°C

SOLDERING

TIME

200°C

PREHEATING TIME

150°C, 90 + 30 SEC.

2.5°C ± 0.5°C/SEC.

3°C + 1°C/- 0.5°C

TIGHT

TYPICAL

LOOSE

ROOM

TEMPERATURE

PREHEATING RATE 3°C + 1°C/- 0.5°C/SEC.

REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.

Note: Non-halide flux should be used.