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AD8398AACPZ-R7 Folha de dados(PDF) 5 Page - Analog Devices |
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AD8398AACPZ-R7 Folha de dados(HTML) 5 Page - Analog Devices |
5 / 13 page AD8398A Rev. D | Page 4 of 12 ABSOLUTE MAXIMUM RATINGS Table 2. Parameter Rating Power Supplies (VCC − VEE) 13.2 V Power Dissipation (TJ MAX − TA)/θJA Storage Temperature Range −65°C to +125°C Operating Temperature Range −40°C to +85°C Lead Temperature (Soldering, 10 sec) 300°C Junction Temperature 150°C MAXIMUM POWER DISSIPATION The maximum safe power dissipation for the AD8398A is limited by its junction temperature (TJ) on the die. The maximum safe TJ of plastic encapsulated devices, as determined by the glass transition temperature of the plastic, is 150°C. Temporarily exceeding this limit may cause a shift in the parametric performance due to a change in the stresses exerted on the die by the package. Exceeding this limit for an extended period can result in device failure. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Figure 3 shows the maximum safe power dissipation in the package vs. the ambient temperature for the 16-lead LFCSP_WQ on a 4-layer board with six vias connecting the exposed pad to the GND plane layer. AMBIENT TEMPERATURE (°C) 0 5 4 3 2 1 TJ = 150°C 6 –40 –30 –20 –10 0 10 20 30 40 50 60 80 70 THERMAL RESISTANCE θJA is specified with the device soldered on a JEDEC circuit board and the thermal pad connected to the GND plane layer using six vias. Table 3. Thermal Resistance Package Type θJA Unit 16-Lead LFCSP_WQ 35.6 °C/W Figure 3. Maximum Safe Power Dissipation vs. Ambient Temperature, 4-Layer JEDEC Board with Six Thermal Vias ESD CAUTION |
Nº de peça semelhante - AD8398AACPZ-R7 |
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Descrição semelhante - AD8398AACPZ-R7 |
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