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HLMP-HG71 Folha de dados(PDF) 10 Page - AVAGO TECHNOLOGIES LIMITED |
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HLMP-HG71 Folha de dados(HTML) 10 Page - AVAGO TECHNOLOGIES LIMITED |
10 / 13 page Avago Technologies - 10 - HLMP-HG70/71, HLMP-HL70/71 Data Sheet Example of Wave Soldering Temperature Profile for TH LED Example of Wave Soldering Temperature Profile for TH LED Ammo Packs Drawing NOTE All dimensions in millimeters (inches). Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) Flux: Rosin flux Solder bath temperature: 255°C ± 5°C (maximum peak temperature = 260°C) Dwell time: 3.0 sec - 5.0 sec (maximum = 5sec) Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. 60 sec Max TIME (sec) 260°C Max 105°C Max 6.35±1.30 0.25±0.0512 12.70±1.00 0.50±0.0394 CATHODE 20.50±1.00 0.8071±0.0394 4.00±0.20 0.1575±0.008 0.70±0.20 0.0276±0.0079 12.70±0.30 0.50±0.0118 9.125±0.625 0.3593±0.0246 18.00±0.50 0.7087±0.0197 TYP Ø VIEW A - A A A |
Nº de peça semelhante - HLMP-HG71 |
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Descrição semelhante - HLMP-HG71 |
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