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SI2323DDS Folha de dados(PDF) 5 Page - Vishay Siliconix |
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SI2323DDS Folha de dados(HTML) 5 Page - Vishay Siliconix |
5 / 10 page Vishay Siliconix Si2323DDS Document Number: 64004 S13-1165-Rev. A, 13-May-13 www.vishay.com 5 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 For technical questions, contact: pmostechsupport@vishay.com TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted) * The power dissipation PD is based on TJ(max.) = 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package limit. Current Derating* 0 1.5 3 4.5 6 0 25 50 75 100 125 150 T C - Case Temperature ( °C) Power Derating, Junction-to-Foot 0 0.5 1 1.5 2 0 25 50 75 100 125 150 T C - Case Temperature ( °C) Power, Junction-to-Ambient 0 0.18 0.36 0.54 0.72 0.9 0 25 50 75 100 125 150 T A - Ambient Temperature (°C) |
Nº de peça semelhante - SI2323DDS |
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Descrição semelhante - SI2323DDS |
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