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CDCVF2505D Folha de dados(PDF) 4 Page - Texas Instruments

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Nome de Peças CDCVF2505D
Descrição Electrónicos  3.3-V Clock Phase-Lock Loop Clock Driver
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Fabricante Electrônico  TI1 [Texas Instruments]
Página de início  http://www.ti.com
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CDCVF2505D Folha de dados(HTML) 4 Page - Texas Instruments

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CDCVF2505
SCAS640G – JULY 2000 – REVISED AUGUST 2016
www.ti.com
Product Folder Links: CDCVF2505
Submit Documentation Feedback
Copyright © 2000–2016, Texas Instruments Incorporated
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
(3)
This value is limited to 4.3 V maximum.
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
VDD
Supply voltage
–0.5
4.3
V
VI
Input voltage(2)(3)
–0.5
VDD + 0.5
V
VO
Output voltage(2)(3)
–0.5
VDD + 0.5
V
IIK
Input clamp current (VI < 0 or VI > VDD)
±50
mA
IOK
Output clamp current (VO < 0 or VO > VDD)
±50
mA
IO
Continuous total output current (VO = 0 to VDD)
±50
mA
Tstg
Storage temperature
–65
150
°C
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
±1000
Machine model (MM)
±300
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
VDD
Supply voltage
3
3.3
3.6
V
VIH
High-level input voltage
0.7 VDD
V
VIL
Low-level input voltage
0.3 VDD
V
VI
Input voltage
0
VDD
V
IOH
High-level output current
–12
mA
IOL
Low-level output current
12
mA
TA
Operating free-air temperature
–40
85
°C
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
(2)
The package thermal impedance is calculated in accordance with JESD 51.
7.4 Thermal Information
THERMAL METRIC(1)
CDCVF2505
UNIT
D (SOIC)
PW (TSSOP)
8 PINS
8 PINS
RθJA
Junction-to-ambient thermal resistance(2)
112.3
175.8
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
55.8
61.8
°C/W
RθJB
Junction-to-board thermal resistance
53.1
104.3
°C/W
ψJT
Junction-to-top characterization parameter
12.8
7.7
°C/W
ψJB
Junction-to-board characterization parameter
52.5
102.6
°C/W
RθJC(bot)
Junction-to-case (bottom) thermal resistance
°C/W


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