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TPL7407LAPWR Folha de dados(PDF) 4 Page - Texas Instruments |
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TPL7407LAPWR Folha de dados(HTML) 4 Page - Texas Instruments |
4 / 22 page 4 TPL7407LA SLRS073 – MAY 2017 www.ti.com Product Folder Links: TPL7407LA Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to the GND/substrate pin, unless otherwise noted. (3) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. (4) The package thermal impedance is calculated in accordance with JESD 51-7. 6 Specifications 6.1 Absolute Maximum Ratings at 25°C free-air temperature (unless otherwise noted) (1) MIN MAX UNIT VOUT Pins OUT1-OUT7 to GND voltage –0.3 32 V VOK Output clamp diode reverse voltage(2) –0.3 32 V VCOM COM pin voltage(2) –0.3 32 V VIN Pins IN1-IN7 to GND voltage (2) –0.3 30 V IDS Continuous drain current per channel(3) (4) 600 mA IOK Output clamp current 500 mA IGND Total continuous GND-pin current –2 A TJ Operating virtual junction temperature –40 150 °C Tstg Storage temperature –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 500-V HBM is possible with the necessary precautions. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 250-V CDM is possible with the necessary precautions. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V Charged-device model (CDM), per JEDEC specification JESD22- C101(2) ±500 6.3 Recommended Operating Conditions Over operating temperature range MIN MAX UNIT VOUT OUT1 – OUT7 pin voltage for recommended operation 0 30 V VCOM COM pin voltage range for full output drive 6.5 30 V VIL IN1- IN7 input low voltage ("Off" high impedance output) 0.9 V VIH IN1- IN7 input high voltage ("Full Drive" low impedance output) 1.5 V TA Operating free-air temperature –40 125 °C IDS Continuous drain current 0 500 mA (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.4 Thermal Information THERMAL METRIC(1) TPL7407LA UNIT TSSOP (PW) 16 PINS θJA Junction-to-ambient thermal resistance 113.1 °C/W θJCtop Junction-to-case (top) thermal resistance 46.5 °C/W θJB Junction-to-board thermal resistance 58.6 °C/W ψJT Junction-to-top characterization parameter 7 °C/W ψJB Junction-to-board characterization parameter 58 °C/W |
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