3.50

3.50

7.125

E

X Y

X

COMPONENT

KEEP-OUT AREAS

COMPONENT

KEEP-OUT AREAS

Y

4.50

9.80

116.00

16X 1.60±0.03

0.50

3.50

13.28

1.72

6.29

3X

128X 0.56±0.05(TYP.)

8.00

14.25

4X

8X

58.00

NOTES:

1. 0.56 mm DIAMETER HOLES ARE

CHASSIS GROUND (129HOLES).

REVISIONS

REV.

ECN

DESCRIPTION

DATE

APPROVED

D

UPDATE NOTES

AUG 19/14

J. SI

E

UPDATE PCB THICKNESS

NOV 02/15

J.SI

F

REMOVED DIM. ZONE B5, SHEET 2 OF 5

NOV 02/16

J.SI

2X8 PCB LAYOUT

1 DECIMAL PLACE

GENERAL TOLERANCES

B

C

D

12

A

3

2

1

4

B

A

56

C

SEE NOTES

NOV02/15

FEB 06/14

NOV02/15

J. SI

MATERIAL AND FINISH

A4

2:1

SHEET 4 OF 5

F

2X8 SFP ULTRAPORT WITH LIGHT PIPE

REFERENCE IN PARENTHESES

OPTIONS AND EMI SPRING FINGER

ECN Exxxxx

P. OU

P-UE86-3G8620-X0X61

3

USED FOR MANUFACTURING PURPOSES WITHOUT WRITTEN PERMISSION FROM AMPHENOL CANADA CORP.

03554

SCALE:

J. SI

DIMENSIONS ARE IN MILLIMETERS

ANGULAR DEGREES

ENG. REL. NO.

THIS DOCUMENT CONTAINS PROPRIETARY INFORMATION AND SUCH INFORMATION MAY NOT BE DISCLOSED TO OTHERS FOR ANY PURPOSE OR 

DO NOT

2 DECIMAL PLACE

PROJECTION

REF.

DWG APP'D

Q.A. APP'D

M.E. APP'D

CHECKED

DRAWN

3 DECIMAL PLACE

UNLESS SPECIFIED OTHERWISE

THIRD

DRAWING

DWG SIZE:

ANGLE

SCALE

A Division of Amphenol Corp. www.amphenolcanada.com

DWG. NO.

REV

CODE ID NO.

Amphenol High Speed Interconnects

0.25

0.15

N/A

1