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CS497014 Folha de dados(PDF) 10 Page - Cirrus Logic |
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CS497014 Folha de dados(HTML) 10 Page - Cirrus Logic |
10 / 31 page CS4970x4 Data Sheet 32-bit High Definition Audio Decoder DSP Family DS752F1 10 5.5 Thermal Data (128-pin LQFP) Notes: 1. Two-layer board is specified as a 76 mm X 114 mm, 1.6 mm thick FR-4 material with 1-oz. copper covering 20% of the top and bottom layers. 2. Four-layer board is specified as a 76 mm X 114 mm, 1.6 mm thick FR-4 material with 1-oz. copper covering 20% of the top and bottom layers and 0.5-oz. copper covering 90% of the internal power plane and ground plane layers. 3. To calculate the die temperature for a given power dissipation j = Ambient Temperature + [ (Power Dissipation in Watts) * ja ] 4. To calculate the case temperature for a given power dissipation c = j - [ (Power Dissipation in Watts) * jt Parameter Symbol Min Typ Max Unit Thermal Resistance (Junction to Ambient) Two-layer Board1 Four-layer Board2 ja — — 53 44 — — °C / Watt Thermal Resistance (Junction to Top of Package) Two-layer Board1 Four-layer Board2 jt — — .45 .39 — — °C / Watt |
Nº de peça semelhante - CS497014 |
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Descrição semelhante - CS497014 |
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