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SM5009CN2S Folha de dados(PDF) 2 Page - Nippon Precision Circuits Inc |
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SM5009CN2S Folha de dados(HTML) 2 Page - Nippon Precision Circuits Inc |
2 / 20 page SM5009 series NIPPON PRECISION CIRCUITS INC.—2 PAD LAYOUT (Unit: µm) PINOUT (Top view) PIN DESCRIPTION and PAD DIMENSIONS Chip size: 0.92 × 1.22 mm Chip thickness: 300 ± 30 µm Chip base: VDD level Q VDD XT VSS (0,0) (920,1220) X Y INH XT 1 XT VSS Q VDD 4 2 3 NC NC 8 7 6 5 XT INH Number Name I/O Description Pad dimensions [µm] XY 1INH I Output state control input. Standby mode when LOW, pull-up resistor built-in. In the case of the CF5009AL ×, the oscillator stops and power-save pull-up resistor built in to reduce current consumption at standby mode. 195 212 2 XT I Amplifier input. Crystal oscillator connection pins. Crystal oscillator connected between XT and XT 385 212 3XT O Amplifier output. 575 212 4 VSS – Ground 766 212 5Q O Output. Output frequency (fO, fO/2, fO/4, fO/8, fO/16, fO/32) determined by internal connection 765 1062 6 NC – No connection – – 7 NC – No connection – – 8 VDD – Supply voltage 162 1062 |
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Descrição semelhante - SM5009CN2S |
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