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SN74AUP1G79

SCES592I – JULY 2004 – REVISED SEPTEMBER 2017

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Copyright © 2004–2017, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Pin Configuration and Functions ......................... 3

6

Specifications......................................................... 4

6.1

Absolute Maximum Ratings ...................................... 4

6.2

ESD Ratings.............................................................. 4

6.3

Recommended Operating Conditions ....................... 5

6.4

Thermal Information .................................................. 5

6.5

6.6

6.7

Timing Requirements ................................................ 8

6.8

6.9

6.10

6.11

6.12

Operating Characteristics...................................... 11

6.13

Typical Characteristics .......................................... 12

7

Parameter Measurement Information ................ 13

7.1

Propagation Delays, Setup and Hold Times, and

Pulse Width .............................................................. 13

7.2

Enable and Disable Times ...................................... 14

8

Detailed Description ............................................ 15

8.1

Overview ................................................................. 15

8.2

Functional Block Diagram ....................................... 15

8.3

Feature Description................................................. 15

8.4

Device Functional Modes........................................ 16

9

Applications, Implementation, and Layout ....... 17

9.1

Application Information............................................ 17

9.2

Typical Application .................................................. 17

10

Power Supply Recommendations ..................... 19

11

Layout................................................................... 19

11.1

Layout Guidelines ................................................. 19

11.2

Layout Example .................................................... 19

12

Device and Documentation Support ................. 20

12.1

Documentation Support ........................................ 20

12.2

Receiving Notification of Documentation Updates 20

12.3

Community Resources.......................................... 20

12.4

Trademarks ........................................................... 20

12.5

Electrostatic Discharge Caution ............................ 20

12.6

Glossary ................................................................ 20

13

Mechanical, Packaging, and Orderable

Information ........................................................... 20

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision H (April 2015) to Revision I

Page

•

Added DPW (X2SON) package.............................................................................................................................................. 1

•

•

Changed values in the Thermal Information table to align with JEDEC standards. .............................................................. 5

•

Added Balanced High-Drive CMOS Push-Pull Outputs, Standard CMOS Inputs, Clamp Diodes, Partial Power Down

•

Added Receiving Notification of Documentation Updates and Community Resources ....................................................... 20

Changes from Revision G (May 2010) to Revision H

Page

•

Updated document to the new TI data sheet format .............................................................................................................. 1

•

Removed Ordering Information table .................................................................................................................................... 1

•

Added Device Information table ............................................................................................................................................ 1

•

Added Typical Characteristics section.................................................................................................................................. 12