PRODUCT SPECIFICATION

FAN5009

REV. 1.0.5 7/22/04

3

Absolute Maximum Ratings

Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is

a stress rating only and functional operation of the device at these or other conditions beyond those indicated in

the operational section of this specification is not implied. Exposure to the absolute maximum rating conditions for

extended periods may affect device reliability. Absolute maximum ratings apply individually, not in combination.

Unless otherwise specified, voltages are referenced to PGND.

Notes:

1. For transient derating beyond the levels indicated, refer to the graphs on page 7.

Thermal Information

Recommended Operating Conditions

Parameter

Min.

Max.

Units

VCC to PGND

–0.3

15

V

PWM and OD pins

–0.3

5.5

V

SW to PGND

Continuous

–1

15

V

Transient ( t=100nsec, F

≤500kHz)

25

V

BOOT to SW

–0.3

15

V

BOOT to PGND

Continuous

–0.3

30

V

Transient ( t=100nsec, F

≤500kHz)

V

HDRV

V

LDRV

Continuous

–0.5

V

Transient ( t=200nsec)

V

Parameter

Min.

Typ.

Max.

Units

150

°C

Storage Temperature

–65

150

°C

Lead Soldering Temperature, 10 seconds

300

°C

Vapor Phase, 60 seconds

215

°C

Infrared, 15 seconds

220

°C

715

mW

Thermal Resistance, SO8 – Junction to Case

40

°C/W

Thermal Resistance, SO8 – Junction to Ambient

140

°C/W

Thermal Resistance, MLP – Junction to Paddle

4

°C/W

Parameter

Conditions

Min.

Typ.

Max.

Units

Supply Voltage VCC

VCC to PGND

10

12

13.5

V

85

°C

125

°C