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FAN5009MPX Folha de dados(PDF) 10 Page - Fairchild Semiconductor |
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FAN5009MPX Folha de dados(HTML) 10 Page - Fairchild Semiconductor |
10 / 13 page 10 REV. 1.0.5 7/22/04 FAN5009 PRODUCT SPECIFICATION 5. The paddle on the MLP package is internally referenced to ground. It can be left floating or connected to ground. For best thermal performance it should be connected to ground as shown in Figure 7. Figure 7. Recommended layout for MLP package. Also accepts SO8 package (not to scale) 6. The recommended land pattern shown in the MLP mechanical dimensions will work with both MLP-8 and SO-8 packages. The circuit in Figure 1 illustrates a typical implementation of a single phase of a multi-phase buck converter for VCORE applications. For a complete VR10 design example, please refer to the FAN5019 or FAN5018 datasheets. 1 2 3 4 8 7 6 5 C BOOT C VCC GROUND VIAS PADDLE |
Nº de peça semelhante - FAN5009MPX |
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Descrição semelhante - FAN5009MPX |
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